USHIO Will Present at JPCA SHOW 2013 its Newly Developed Direct Imaging System "UDI Series" for Manufacturing Printed-Circuit Boards

Direct Image Achieves Resolution of 5 µm L/S and High Throughput of 35 Seconds/Panel

USHIO INC., today announced that the company has succeeded in developing the ultra-fine, high-speed direct imaging (DI)  system “UDI-8001P” with a resolution of 5 µm L/S and throughput of 35 seconds/panel. The “UDI-8001P”, which can be used for manufacturing next-generation FC-BGA packages for computers and network equipment, will be presented at booth 3I-03 of JPCA Show 2013, to be held at Tokyo Big Sight on June 5 (Wed.) through 7 (Fri.), as well as at the NPI Presentation Program on June 7.

The DI systems currently used for manufacturing high-end packages such as FC-CSPs have a resolution of 10 to 15 µm L/S, an overlay accuracy of ±10 µm, and approx. 10 alignment points. The UDI-8001P achieves a much higher throughput — 35 seconds/panel — than conventional DI systems while offering a resolution of ±5 µm L/S, an overlay accuracy of ±5 µm, and 600 alignment points. The UDI-8001P thus allows processing of ultra-fine-pitch FC-BGA packages that could not be processed by the conventional DI systems.

At JPCA Show 2013, USHIO also will simultaneously announce another DI model “UDI-8102P” with resolution of 8 µm L/S for FC-CSP packages.


UDI Series


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