USHIO Exhibits Lithography Tools for Next-Generation Packaging, including 300mm Interposer Stepper UX7-3Di LIS 350 at SEMICON West 2014
Under the slogan “Next-Generation Packaging Solutions”,
USHIO proposes optimum solutions to critical challenges in major packaging applications
USHIO INC. today announced that at SEMICON West 2014 (Booth #2105) the company will exhibit a series of its lithography tools for advanced packaging applications, including the UX7-3Di LIS 350 stepper for 3D/2.5D silicon interposers, through a panel display as well as propose solutions for the challenges of next-generation packaging applications. SEMICON West 2014 is being held on July 8 through July 10 at Moscone Center in San Francisco, California.
Today, 3D packaging applications that use through-silicon via (TSV) and 2.5D/2.1D packaging applications have been spotlighted as the emerging technologies for higher integration of semiconductor devices. Maintaining an optimum balance between technologies and cost for volume production has become one of major challenges for these next-generation packaging applications. In order to provide the best solution for this challenge, USHIO’s UX7-3Di LIS 350 stepper for 3D/2.5D silicon interposers achieves significant cost reduction with its unparalleled performance including single-shot exposure of large substrate areas, high throughput, and high resolution of 2 µm L/S (Line and Space).
In addition, USHIO will exhibit the Square 70 panel stepper for organic and glass interposers for further enhancement of productivity with a large shot size of 78 mm x 68 mm; the Align 600 maskless scanner for fan-out WLP enabling alignment at 600 points to achieve high yield; and the UX4 series full-field projection aligners for LED, MEMS device, and power device applications. In addition to these lithography tools, USHIO is introducing its next-generation packaging solution that leverages a large-field precision projection lens (currently under development) which can produce a super-high resolution of 1 µm L/S.
“The next-generation packaging technologies have been spotlighted as the demand for smartphones and tablet PCs has been skyrocketing. To meet such demanding needs, we have leased and installed a projection aligner dedicated to developing 2.5D glass interposers at the Georgia Tech 3D Systems Packaging Research Center (GT-PRC) in Georgia Institute of Technology by dispatching an engineer. We have aimed at achieving large-area patterning with the target resolution of 1 through 5 µm L/S, and will show some good results at SEMICON West 2014,” commented Masayuki Itaba, General Manager of the Exposure Business Unit, USHIO INC.
USHIO believes that it will be able to provide optimum solutions for the challenges faced by users by integrating its lithography technologies specializing in next-generation packaging applications. Please visit USHIO Booth #2105 at SEMICON West 2014 to confirm its solutions.
- The product data sheet （PDF：115KB）
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