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Exposure systems

Presents diverse exposure systems including projection exposure systems (single-sided, simultaneous and step-and-repeat) and proximity exposure systems

Exposure systems

UX-5--Step & Repeat Projection Exposure System for high-density printed wiring substrates The system achieves a buildup that is suitable for the expansion and contraction of substrates and the high-precision overlaying of multiple-layered patterns.	UX-7--Step & Repeat Projection Exposure System for super-connect region This rough stepper is optimized for design rules in the super-connect region (around 10µmL/S).
TAB/COF--Projection exposure system This projection exposure system for flexible printed circuit boards enables high-precision exposure of fine-pitch TAB/COF tape substrates.	Various exposure systems for electronic components A wide variety of exposure systems (single-sided/simultaneous, lump/split and others) are available to handle a resolution capacity of 3µmL/S to 20µmL/S and exposure areas of Φ100 to 300mm.
Exposure system for MEMS This exposure system is equipped with an equivalent-size optical projection exposure system, with specifications to suit 20mm and up to Φ8-inch wafer and a minimum of 5µmL/S.