Print this paper (2016.10)IMAPS2016 Volume 2016, Issue 1 Improvement of Coherency of the Panel Level Package by Integrated Dry Process Shinichi Endo, Tomoyuki Habu, Akira Aiba, Hiroko Suzuki, Noritaka Takezoe, Hiroki Horibe, Kazuki Arikawa, Masaki Miura, Hajime Kikuiri, Shintaro Yabu Ushio Inc., 2016年10月アメリカパサデナで開催されたｉＭＡＰＳでの発表論文です。フォトデスミアとスパッタシードを組み合わせたインテグレーテッドドライプロセスの提案をパネルレベルパッケージ向けに初めて行いました。 Article published for iMAPS held in October 2016 in Pasadena, USA that presents the first proposal for an integrated dry process that combines photodesmearing and sputtered seed processes for panel level packages. For papers (You are leaving for an external site.) Related products 1074 Large field stepper UX-5 Series UX-7 Series 1002 Excimer lamps/Excimer irradiation unit Related papers Case study 1101 Search a paper Keyword
Improvement of Coherency of the Panel Level Package by Integrated Dry Process Shinichi Endo, Tomoyuki Habu, Akira Aiba, Hiroko Suzuki, Noritaka Takezoe, Hiroki Horibe, Kazuki Arikawa, Masaki Miura, Hajime Kikuiri, Shintaro Yabu Ushio Inc., 2016年10月アメリカパサデナで開催されたｉＭＡＰＳでの発表論文です。フォトデスミアとスパッタシードを組み合わせたインテグレーテッドドライプロセスの提案をパネルレベルパッケージ向けに初めて行いました。 Article published for iMAPS held in October 2016 in Pasadena, USA that presents the first proposal for an integrated dry process that combines photodesmearing and sputtered seed processes for panel level packages. For papers (You are leaving for an external site.)
