Contact/proximity aligners UX-3 Series
- MEMS, Electronic Components
- Liquid Crystal Display
- Printed Circuit Board and PKG
This mask aligner uses light source and optical technologies developed by Ushio over many years.
This exposure device supports not only ihg rays, but the deep UV range as well.
Overlay precision: achieves ±1 um during surface alignment, and ±1.5 um during back side alignment. High-precision registration accuracy is achieved by optimal alignment lighting and image processing software techniques to suit various substrates and alignment marks.
Solar cells and more
|Contact system||Vacuum contact||Hard contact||Proximity|
|Resolution||1 µm L/S||2 µm L/S||3 µm L/S|
|Method of Exposure||Single Side Exposure|
|Wafer size||～Φ200 mm|
|Exposure Wavelength||i, ih and ihg lines|
|Overlay||±1 µm (Top Side) ±1.5 µm (Back Side)|
■Warped Wafer Chuch
■Plenty of Options for MEMS
|Deep Focus||Same resolution on different levels or Sphericial surface|
|Double sides Concurrent Exposure||High Accurancy of Top-side and Back-side masks|
|High Alignment Accurancy||Options of alignment with notch or orientation flat on wafer|
|Handling Options||Bernouilhandling and capability to handle penetrated wafer or Warped Wafer|
Installed light source
Note Regarding Exportation
This equipment (or technology) may be subject to security controls under the provisions of the Foreign Exchange and Foreign Trade Control Law, and in order to export the equipment or technology (or to conduct transactions for the purpose of providing the technology to a non-resident or foreign country), it may be necessary to obtain an export permit (or permission to implement service transactions) from the Minister of Economy, Trade and Industry. Be sure to contact us in advance for confirmation.