UV photoresist curing systems Unihard
- Curing and Bonding
This ultraviolet irradiation device is used for photoresist curing in LSI manufacturing lines.
Equipped with a super high-pressure UV lamp and an excimer lamp, this system is used for various applications such as enhancing plasma resistance during dry etching, photoresist outgassing and burn prevention during ion implantation, neutralizing electrical charge, removing stress and low-k curing.
Applying UV irradiation to finish developing the positive resist causes a polymerization (cross-linking) reaction. The heat-resistance limit of the resist is thereby improved, increasing the heat resistance of various processes.
Utilizing this characteristic contributes to improved yields and productivity.
|Improvement of plasma resistance during dry etching
Resist outgassing and densification for ion implantation
Charge neutralization and stress erasure
Interlayer insulating film formation for thin-film magnetic heads
Compound semiconductor lift-off processing
CCD and CMOS imager breaching and more
|H120 series||12-inch special-purpose equipment Equipped with SEMI-compliant load port to adopt EFEM. GEM300 compliant.|
|H208 series||Support 8-inch and 6-inch devices|