Products
Compact High Power SMDEDCC Faimily(Compact High Power SMD)
The EDCC Family incorporates traditional high-power LED chips with a wide range of wavelength options, yet it achieves an impressive reduction in footprint of approximately 80% when compared to the previous small-sized EDC Family package.
As a result, it offers a compact form factor (W1.5 x L1.85 x H0.9 mm) that closely resembles bare chips and is also compatible with CSP (Chip Scale Package) and other compact-sized packages.
Package area(mm) Example of LED placement |
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Appearance | ||
Radiation Characteristics |
Key Features
・Utilizes high-power LED chips with a wide wavelength range, including UV, visible light, IR, and SWIR, similar to those used in the SMBB Family and EDC Family.
・Compact-sized package, comparable to CSP and high-power LED chips, facilitating easy customization in an SMD-type LED format.
・Package design optimized for high-density integration.
* Pulse Condition: On Time 10us, Duty 1%
** Radiation Characteristics of EDCC Package
・Compact-sized package, comparable to CSP and high-power LED chips, facilitating easy customization in an SMD-type LED format.
・Package design optimized for high-density integration.
Comparison with conventional products
SMBB Flat | EDC Flat | EDCC | |
Package area(mm) | 5.0×5.2 | 3.5×3.5 |
1.5×1.85
80% reduction compared to EDC Family
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Appearance |
SMBB850DS-1100 | EDC850DS-1100 | EDCC850DS-1100 | ||
Vf[V]@1A | 3.2 | 3.2 | 3.2 | |
Vfp[V]@5A* | 4.6 | 4.6 | 4.6 | |
Po[W]@1A | 1.4 | 1.4 | 1.2 | |
Po[W]@5A* | 5.6 | 5.6 | 5.3 | |
Rthjs[K/W] | 9 | 11 | 21 | |
φ1/2[deg.] | 64 | 66 | Long** | 69 |
Short** | 69 |
** Radiation Characteristics of EDCC Package
Applications
Minimum Order Quantity
Parts Numbering
(a) EDCC : Package Family Name
(b) 850 : Peak Wavelength. (unit:nm. From 365nm to 1,900nm)
(c) DS : Structure Type of LED Chips (Restrictive Option)
(d) 1 : Number of Chips (1: 1 Chip)
(e) 100 : LED Chip Dimension (100: 1,000um * 1,000um, 130: 1,300um * 1,300um)