(2016.05)
IEEE 66th Electronic Components and Technology Conference (ECTC)
Full-Sized Panel Photodesmear for Via Residue Cleaning
Masahito Namai, Akira Aiba, Hiroko Suzuki, Hiroki Horibe,
Hajime Kikuiri, Masaki Miura, Kazuki Arikawa,
Noritaka Takezoe, Shinichi Endo, Shintaro Yabu, and Tomoyuki Habu – Ushio, Inc.
2016年6月アメリカオーランドで開催されたECTCでの発表論文です。フルサイズ基板でフォトデスミア処理の検証結果を発表しています。
Article published for the ECTC held in June 2016 in Orlando, USA that presents testing results for full-sized panel photodesmearing.
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