Demonstration of 20 um I/O Pitch RDL Using a Novel, Ultra-Thin Dry Film Photosensitive Dielectric for Panel-Based Glass Interposers

Atsushi Kubo
Tokyo Ohka Kogyo Co. Ltd., Tokyo, Japan
Chandrasekharan Nair
3D Syst. Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Ryuta Furuya
Ushio Inc., Tokyo, Japan
Tomoyuki Ando
3D Syst. Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Hao Lu
3D Syst. Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Fuhan Liu
3D Syst. Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Venky Sundaram
3D Syst. Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Rao Tummala
3D Syst. Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA