Ushio starts selling the UX-58112SC, a new product of the large field stepper UX-5 Series for cutting-edge IC package substrates
Improved resolution and overlay accuracy achieved while maintaining the previous exposure field size
Ushio Inc. (Head office: Tokyo, President and CEO: Koji Naito; hereinafter “Ushio”) hereby announces that it will start selling the UX-58112SC in June 2023, which achieved the world-class high resolution of L/S=3μm, as a large-field stepper for cutting-edge IC package substrates and substantially improved the overlay accuracy.
This product has been awarded “JPCA Show AWARDS 2023*1” at JPCA Show 2023 to be held from May 31 to June 2 at Tokyo Big Sight. During the event, it will be presented by “Monozukuri Taro,” a YouTuber viewing manufacturing jobs and technologies, on stage at East 2 Hall 2C-06.
The UX-58112SC is the newest model of the large field stepper UX-5 series for cutting-edge IC package substrates with a worldwide market share of 90%*2, which is used for the exposure of package substrates for semiconductors installed in a variety of devices such as PCs, smartphones, and tablets.
The semiconductor market has made remarkable development in accordance with Moore’s law that the number of transistors in an integrated circuit (IC) “doubles about every two years.” The miniaturization of transistors was approaching its limit in the 2010s, but the market has continued to expand thanks to the progress of packaging technology and the development of other new technologies such as a chiplet technology in recent years. As a result, the demand for miniaturization for package substrates has been accelerating so the improvement of resolution and overlay accuracy has become essential for lithography equipment.
Therefore, Ushio has successfully developed the UX-58112SC, which achieved the world-class high resolution of L/S=3μm as a large field stepper for IC package substrates and substantially improved the overlay accuracy, while maintaining the previous 250x250mm exposure field size and footprint, by using its expertise and experience accumulated in the IC package substrate industry over many years together with customers combined with its unique optical design technology developed since its foundation.
The UX-58112SC enables achieving higher productivity and yield than before by improving the resolution and overlay accuracy while maintaining the previous high throughput, with an eye on the multi-layered and larger packages of the next-generation package substrates which are essential for the progress of IoT, 5G, and mobility.
As a leading company of large field steppers for cutting-edge IC package substrates, Ushio will contribute to the creation of a convenient and comfortable society with light.
*1 The award is presented to exhibitors who showcased outstanding products and/or technologies, and awardees are determined based on the following criteria: (1) creativity (uniqueness/originality), (2) potential for further development and future in the industrial world, (3) reliability, (4) adaptability to the times, and (5) form of expression (appropriate expression, concise and clear description at the time of application).
*2 In the cutting-edge package substrates market (stepper exposure market) - Ushio’s data as of March 31, 2023.
■Main Features
・Achieved the world-class high resolution of L/S=3μm as a large field stepper and substantially improved the overlay accuracy
・ Light source and other components are instrumented by Ushio’s proprietary design
・ Improved the resolution and overlay accuracy while maintaining the previous exposure field size and throughput
■Appearance
■Specifications
*Appearance and specifications are subject to change without prior notice.
This product has been awarded “JPCA Show AWARDS 2023*1” at JPCA Show 2023 to be held from May 31 to June 2 at Tokyo Big Sight. During the event, it will be presented by “Monozukuri Taro,” a YouTuber viewing manufacturing jobs and technologies, on stage at East 2 Hall 2C-06.
The UX-58112SC is the newest model of the large field stepper UX-5 series for cutting-edge IC package substrates with a worldwide market share of 90%*2, which is used for the exposure of package substrates for semiconductors installed in a variety of devices such as PCs, smartphones, and tablets.
The semiconductor market has made remarkable development in accordance with Moore’s law that the number of transistors in an integrated circuit (IC) “doubles about every two years.” The miniaturization of transistors was approaching its limit in the 2010s, but the market has continued to expand thanks to the progress of packaging technology and the development of other new technologies such as a chiplet technology in recent years. As a result, the demand for miniaturization for package substrates has been accelerating so the improvement of resolution and overlay accuracy has become essential for lithography equipment.
Therefore, Ushio has successfully developed the UX-58112SC, which achieved the world-class high resolution of L/S=3μm as a large field stepper for IC package substrates and substantially improved the overlay accuracy, while maintaining the previous 250x250mm exposure field size and footprint, by using its expertise and experience accumulated in the IC package substrate industry over many years together with customers combined with its unique optical design technology developed since its foundation.
The UX-58112SC enables achieving higher productivity and yield than before by improving the resolution and overlay accuracy while maintaining the previous high throughput, with an eye on the multi-layered and larger packages of the next-generation package substrates which are essential for the progress of IoT, 5G, and mobility.
As a leading company of large field steppers for cutting-edge IC package substrates, Ushio will contribute to the creation of a convenient and comfortable society with light.
*1 The award is presented to exhibitors who showcased outstanding products and/or technologies, and awardees are determined based on the following criteria: (1) creativity (uniqueness/originality), (2) potential for further development and future in the industrial world, (3) reliability, (4) adaptability to the times, and (5) form of expression (appropriate expression, concise and clear description at the time of application).
*2 In the cutting-edge package substrates market (stepper exposure market) - Ushio’s data as of March 31, 2023.
■Main Features
・Achieved the world-class high resolution of L/S=3μm as a large field stepper and substantially improved the overlay accuracy
・ Light source and other components are instrumented by Ushio’s proprietary design
・ Improved the resolution and overlay accuracy while maintaining the previous exposure field size and throughput
■Appearance
■Specifications
| Product name | UX-58112SC | UX-5894SC (previous model) | |
|---|---|---|---|
| Exposure field size | 250×250mm | ||
| Substrate size | SEMI Standards 510×515mm | ||
| Resolution | 3μm L/S | 5μm L/S | |
| Throughput | 30 seconds/panel | ||
| Exposure wavelength | i-line | ||
