Room temperature bonding through surface activation

  • Modification
  • Curing and Bonding
  • Energy
  • Printed Circuit Board and PKG
  • Liquid Crystal Display
  • MEMS, Electronic Components
  • Functional Materials
  • Printing
  • Biology and Chemistry
  • Semiconductors
"Adhesive-free bonding" and "increased bonding strength" achieved through surface activation and removal of organic matter.

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