ApplicationsMaterial processing

Light is indispensable in any manufacturing process. UV curing and bonding are widely applied in the fabrication of electronic components, flat-panel displays, resin products, and in the drying of inks. Heating by light is a technology that can achieve non-contact treatment in a short time, which is not the case with conventional methods such as furnaces and hot air, and is indispensable to the semiconductor industry. Ushio's conventional light sources are already used in various manufacturing processes, and these are now joined by the modern innovation of solid state LED. Ushio proposes the best LED to realize the best results.

• Cure (adhesion / Hardening)

  The history of UV curing began with its use in the hardening of paints in the 1960s, and its use has been expanding ever since. Ushio UV lamps have contributed to many manufacturing process innovations. epitex UV-LEDs are able to respond to highly advanced requirements thanks to their wavelength selectivity (365, 375, 385, 395, 405 nm, and so on, increasing in 10 nm increments), low heat generation due to high-efficiency light emission, and a variety of packages in order to realize your ideal lighting.

  • Electronic component bonding
  • Optical component bonding
  • Nanoimprint
  • Surface modification
  • Dicing tape curing

• Heating and Drying

  The most familiar use of non-contact heating with light is toner fixing for copiers. This technology has revolutionized the semiconductor manufacturing industry by realizing "non-contact and instantaneous heating" using a high-power lamp light source. The pursuit for the possibility of heating and drying by light continues on LED light sources. Further innovations are being sought with high-efficiency and wavelength-selectable LEDs.

  • Drying
  • Heating (for semiconductor・FPD)