Notice of Investment in Rapidus Corporation

Ushio Inc. (Head office: Tokyo, President and CEO: Takabumi Asahi, hereinafter "Ushio") hereby announces that it has subscribed to a third-party allotment of new shares conducted by Rapidus Corporation (Head office: Tokyo, President and CEO: Atsuyoshi Koike; hereinafter "Rapidus"), and that the investment procedures have been completed.

Since its fiscal year 2022, Rapidus has received subsidies from Japan’s New Energy and Industrial Technology Development Organization under the “Post-5G Information and Communication Systems Infrastructure Enhancement R&D Project / Development of Advanced Semiconductor Manufacturing Technology (Commissioned)” aiming for mass production of 2nm-generation logic semiconductors by 2027. These projects are part of the “Research and Development of 2nm-Generation Semiconductor Integration Technology and Short Turnaround Time (TAT) Manufacturing Technology Based on Japan–U.S. Collaboration” and “Development of Chiplet, Package Design and Manufacturing Technology for 2nm-Generation Semiconductors.”

Ushio is working to strengthen its product lineup to address technical challenges in the advanced packaging field. Through this investment, Ushio aims to contribute to the establishment of a domestic mass production base for advanced semiconductors, deepen its expertise in cutting-edge technologies and market trends, and leverage these insights for future product development.


Ushio will continue to contribute to the realization of a convenient and comfortable society as a leading company in optical technology, focusing on lithography equipment for advanced package substrates.