Ushio will install Electron Beam Review System for Full-Panel Advanced Package
Improving significantly lithography tool development and production efficiency by installing metrology tool for next-generation packaging processes
Ushio Inc. (Head office: Tokyo, President and CEO: Takabumi Asahi, hereinafter "Ushio") announces that it has installed an electron beam review system (hereinafter "EBR system") manufactured by Applied Materials, Inc. for advanced packaging, which is scheduled to begin operation in 2026.
Ushio and Applied Materials jointly develop, manufacture, and sell the digital lithography technology (DLT) system specifically designed for patterning the advanced substrates needed in the Artificial Intelligence (AI) era of computing.
The newly installed EBR system from Applied Materials eliminates the need to cut the panel into individual pieces as required for SEM measurements and enables non-destructive measurement in the full panel size format. This enhances measurement by approximately 30 times faster than conventional methods. In addition, it has measurement capability for CD uniformity under 2 μm patterns, where the conventional optical measurement does not have enough measurement stability. This capability is expected to significantly improve the efficiency of DLT system development, evaluation, and in-house inspection.
By utilizing this measurement technology from Applied Materials, Ushio will accelerate the introduction of the DLT system. As a leading company in lithography equipment for advanced packaging, Ushio will continue to contribute to technological innovation in advanced packaging and to the realization of a more convenient and comfortable society through "light" technology.