Non-electrolytic copper plating pattern by photosensitive material patterning

  • Curing and Bonding
  • Modification
  • Litho-Patterning
  • Printed Circuit Board and PKG
  • Liquid Crystal Display
  • MEMS, Electronic Components
  • Semiconductors
Example of non-electrolytic copper plating pattern using a photosensitive material as a seed layer with absorptivity in the deep UV wavelength region. (Data provided by: Materials & Surface Engineering Research Institute, Kanto Gakuin University, and JCU Corporation)

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