Non-electrolytic copper plating pattern by surface modification patterning

  • Litho-Patterning
  • Modification
  • MEMS, Electronic Components
  • Printed Circuit Board and PKG
  • Semiconductors
  • Liquid Crystal Display
Selective creation of hydrophilic region through photomasks of resin film, etc. The non-electrolytic copper plating pattern is formed after adsorption by just the hydrophilic region of the plating seed layer. Conductors can be formed without resorting to photoresist patterning.