News list

Product and technology

• 2026.06.04

  Accepting Orders for the LED Light Source–Equipped New Products “UX-44101SCB / UX-45114SCB” of the UX-4 Series, Full Field Projection Aligner for Wafers

• 2026.03.19

  Ushio will install Electron Beam Review System for Full-Panel Advanced Package

• 2025.12.12

  Orders Now Open for the New Product “UX-45114SC” of the UX-4 Series, Full Field Projection Aligner for Wafers

• 2025.09.03

  Participating in "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging

• 2025.08.26

  Responding to Photoelectronic Fusion - Ushio Develops New Interference Lithography Equipment with Pitch Compensation Optics and Phase Shift Formation Function

• 2025.08.05

  Announcement of the planned launch of a 1.5μm resolution stepper
  - Expanding the product lineup for advanced packaging -

• 2025.04.01

  Ushio’s red multi-beam laser diode for printers wins the Laser Industry Award for Excellent Product in the 17th Industry Award of The Laser Society of Japan

• 2025.01.16

  Ushio has developed technology that can decompose and detoxify PFAS (per- and polyfluoroalkyl substances) using light without employing catalysts or additives

• 2024.12.10

  Ushio launches atmospheric pressure plasma irradiation unit “Lamina 5,” one of the smallest unit sizes in the industry

• 2024.10.29

  Ushio Has Developed an Ultra-compact SWIR LED Package with a Footprint of 0.6 x 0.3 mm

• 2024.02.08

  Ushio participates in Tokyo Metropolitan University’s Direct Air Capture (DAC) R&D together with Taikisha Ltd.

• 2023.12.13

  Breakthrough digital lithography technology from Applied Materials and Ushio to enable more powerful computing systems for the AI era

• 2023.07.03

  Ushio's high-power 700nm laser diode is awarded top prize in the Quantum Technology category of the LASER World of PHOTONICS Innovation Award 2023

• 2023.05.24

  Ushio starts selling the UX-58112SC, a new product of the large field stepper UX-5 Series for cutting-edge IC package substrates

• 2023.04.20

  Ushio’s technology that uses light to reduce greenhouse gas emissions has been chosen as the “FY2023 Research Theme for Sewers Application Research” by the Ministry of Land, Infrastructure, Transport and Tourism of Japan

• 2023.01.19

  Safety evaluation of 222nm Far UV-C irradiation to the corneal limbus

• 2023.01.11

  Ushio starts mass production of new 405nm, 175mW single mode laser diode with industry’s widest operation temperature

• 2022.12.20

  Ushio participates in Osaka University’s joint research and development project on conversion of methane gas into formic acid and methanol

• 2022.10.27

  Ushio releases a high-power blue laser module which achieved a significant cost reduction

• 2022.10.19

  CounterAct UR10 added to line of UVC disinfection fixtures