News list

Product and technology

• 2015.12.14

  Ushio America, Inc. Has Started Marketing Leading-Edge PVD Systems of Tango Systems Inc. in the Japanese Market

• 2015.06.24

  Ushio and Columbia University Have Entered into Exclusive University and Research Agreements for Ultraviolet Disinfection Method to Reduce Microbial Infection
  – Preventing Microbial Infection at Surgical Sites –

• 2014.10.27

  USHIO OPTO SEMICONDUCTORS, INC. Launches Website

• 2014.09.30

  USHIO Has Booked Order for "UX4" Large-Area, Full-Field Projection Lithography System from CiS Research Institute in Germany

• 2014.07.07

  USHIO Exhibits Lithography Tools for Next-Generation Packaging, including 300mm Interposer Stepper UX7-3Di LIS 350 at SEMICON West 2014

• 2013.12.02

  USHIO Installed a Projection Aligner to Develop 2.5 Glass Interposers for Participating in 2.5D Interposer Consortium Sponsored by Georgiatech 3D Systems Packaging Research Center (GT-PRC)

• 2013.07.08

  USHIO Has Booked its 2.5D/3D Interposer Stepper UX7-3Di LIS 350 and Will Deliver the First Unit to a Leading Advanced-Packaging Manufacturer by the End of July

• 2013.05.29

  USHIO Will Present at JPCA SHOW 2013 its Newly Developed Direct Imaging System "UDI Series" for Manufacturing Printed-Circuit Boards

• 2013.05.09

  USHIO to Consolidate EUV Business into a Single Unit in Japan and Continue its Business for Inspection and Development Applications

• 2013.04.22

  Japan's First Quantitative Assay of Serum Ferittin Based on Immunochromatography Commencement of Domestic Sale of Point Reader® Blood Analyzer and Corresponding Reagents

• 2012.12.04

  USHIO Announces at SEMICON Japan 2012 that It Will Start Shipping New Large-Field Interposer Stepper Model "UX7-3DI LIS 350" in March 2013

• 2012.08.28

  USHIO to Begin Sales of Superline LED Series

• 2012.07.09

  USHIO Debuts New Large-Field Stepper UX7-3Di Series for 2.5D/3D Packaging at SEMICON West 2012

• 2012.07.09

  USHIO Debuts World's Thinnest UV Irradiance Meter “UIT-θ365” at SEMICON West 2012

• 2011.12.05

  USHIO Introduces Three Lithography-System Models
  for Power Devices, MEMS, and 3D LSI Devices

• 2011.10.27

  USHIO Group Company's EUV Light Source Achieves Output of 30 W at Intermediate Focus

• 2011.09.05

  USHIO Announces Debut of World's First
  200-mm Wafer Full-Field Projection Lithography System "UX4-3Di FFPL 200"
  for High-Volume Manufacturing of 3D LSI Devices

• 2011.07.12

  USHIO Announces Debut of Two New UX4-LEDs Series Models at SEMICON WEST 2011

• 2011.07.12

  IMEC Announces Printing of the First Extreme Ultra Violet (EUV)-Light Wafers with ASML NXE:3100 Mounted with XTREME’s Laser-Assisted Discharge Plasma (LDP) Source. For Details, Visit Imec News.

• 2011.03.04

  European Research Institute to Start Bringing in EUV Light Source Produced by USHIO