Transactions of The Japan Institute of Electronics Packaging（Trans JIEP）
エレクトロニクス実装学会 Vol.13.2020
Result of Highly Accelerated Stress Test of Organic Substrate Made by Integrated Dry Process
Shinichi Endo*, Tomoyuki Habu**, and Shintaro Yabu***
*System Solution Division, Ushio Inc., 6-1-1 Nishinakajima, Yodogawaku, Osaka City, Osaka 532-0011, Japan
**Process Collaboration Group, Ushio Technology laboratory, Ushio Inc., 1194 Sazuchi, Besshocho, Himeji City, Hyogo 671-0224, Japan
***Ushio America Inc., Cypress, CA 90630, USA
Abstract
We made the large experimental tool where Photodesmear could process an actual size of the print circuit board by static irradiation. And we proved that handling of such panel size was technically possible. The connection reliability of the contact via was evaluated after electric copper plating by quick via peel examination. We made a cross-section sample of the contact via holes and the smear removal properties of wet desmear processing and the Photodesmear processing were compared with the residual smear and the oxidation thin layer by obser vation of the connection interface. The interfacial surface state after desmear processing was analyzed in an X-ray photoelectron spectrum analyzer. We pro-duced the test vehicle using Photodesmear technology and sputtering seed technology. We compared it with the same pattern sample produced by a conventional process. In this paper, we report the results of the highly accelerated tem-perature and humidity stress test.
Keywords:Semi Additive Process, Printed Circuit Board, Integrated Dry Process, Photodesmear, Sputter,Vacuum Ultraviolet Light, Panel Level Package
