Flash lamp annealer
- Modification and Decomposition
- MEMS, Electronic Components
- Liquid Crystal Display
- Printed Circuit Board and PKG
Flash lamp annealing allows very short heating processes as quick as one millisecond.
UV to visible wavelength light emitted from the flash lamp can concentrate heat on a substrate (material) surface so that the thermal influence on the underlying film or substrate
can be extremely small compared with conventional heat sources.
This millisecond surface heat treatment is becoming an essential technology for future device developments such as zero diffusion of semiconductor implanted layers and thermal budget reduction.
Flash lamp heating is also used to produce reactions such as crystallization, bonding, peeling, decomposition and curing. These characteristics are effectively applied in various research and development applications such as Si wafers, SiC wafers, glass, plastic films and other flexible substrates, as well as in production (manufacturing) line applications.
We welcome requests for experimental demonstrations. Please feel free to contact us.
Ultra-thin oxide film formation
Ferroelectric capacitor deposition
Amorphous silicon polycrystallization
Firing and sintering of metal nano-inks and nano-pastes (e.g., copper)
Si and SiC substrate activation annealing
SOI and SOS substrate annealing
Flexible substrate surface heating
Heating of UV curing and thermosetting resins
Installed light source
How do flash lamps differ from other heat sources?
Whereas other heat sources heat the target object in its entirety, a flash lamp produces only an extremely brief pulse of light that makes it possible to selectively heat just the surface of the target. The ability to heat selectively is useful when heating objects that have low heat resistance, or when the reaction induced by heating is to be limited to just the surface layer of a substrate.